Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
TDU03DTON

TDU03DTON

CONN SOCKET TRANSIST 3POS GOLD

Sullins Connector Solutions

893 -
RFQ
TDU03DTON

Datasheet

Tray - Active Transistor 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
214-3339-00-0602J

214-3339-00-0602J

CONN IC DIP SOCKET ZIF 14POS GLD

3M

189 -
RFQ
214-3339-00-0602J

Datasheet

Tube Textool™ Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
224-1275-00-0602J

224-1275-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M

2,825 -
RFQ
224-1275-00-0602J

Datasheet

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
1-2324271-3

1-2324271-3

RIGHT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

5,113 -
RFQ
1-2324271-3

Datasheet

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1-2324271-4

1-2324271-4

LEFT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

4,833 -
RFQ
1-2324271-4

Datasheet

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
220-3342-00-0602J

220-3342-00-0602J

CONN IC DIP SOCKET ZIF 20POS GLD

3M

2,032 -
RFQ
220-3342-00-0602J

Datasheet

Tube Textool™ Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
208-7391-55-1902

208-7391-55-1902

CONN SOCKET SOIC 8POS GOLD

3M

325 -
RFQ
208-7391-55-1902

Datasheet

Bulk Textool™ Active SOIC 8 (2 x 4) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
2-2129710-5

2-2129710-5

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

654 -
RFQ
2-2129710-5

Datasheet

Tray - Active LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic
2-2129710-6

2-2129710-6

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

1,188 -
RFQ
2-2129710-6

Datasheet

Tray - Active LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic
248-1282-00-0602J

248-1282-00-0602J

CONN IC DIP SOCKET ZIF 48POS GLD

3M

181 -
RFQ
248-1282-00-0602J

Datasheet

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
216-7224-55-1902

216-7224-55-1902

CONN SOCKET SOIC 16POS GOLD

3M

345 -
RFQ
216-7224-55-1902

Datasheet

Bulk Textool™ Active SOIC 16 (2 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
203-2737-55-1102

203-2737-55-1102

CONN TRANSIST TO-3/TO-66 3POS

3M

295 -
RFQ
203-2737-55-1102

Datasheet

Bulk Textool™ Active Transistor, TO-3 and TO-66 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234 (5.94mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
210-2599-00-0602

210-2599-00-0602

CONN SOCKET SIP ZIF 10POS GOLD

3M

210 -
RFQ
210-2599-00-0602

Datasheet

Bulk Textool™ Active SIP, ZIF (ZIP) 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
220-2600-00-0602

220-2600-00-0602

CONN SOCKET SIP ZIF 20POS GOLD

3M

496 -
RFQ
220-2600-00-0602

Datasheet

Bulk Textool™ Active SIP, ZIF (ZIP) 20 (1 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
169-PRS13001-12

169-PRS13001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

135 -
RFQ
169-PRS13001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
225-PRS15001-12

225-PRS15001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

127 -
RFQ
225-PRS15001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) 225 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
289-PRS17001-12

289-PRS17001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,350 -
RFQ
289-PRS17001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
361-PRS19001-12

361-PRS19001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,657 -
RFQ
361-PRS19001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
441-PRS21001-12

441-PRS21001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,081 -
RFQ
441-PRS21001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
ICS-306-T

ICS-306-T

IC SOCKET, DIP, 6P 2.54MM PITCH

Adam Tech

9,260 -
RFQ
ICS-306-T

Datasheet

Tube ICS Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
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